“无铅制程的工艺、缺陷侦测及可靠性”
1) 焊料和焊接基础知识Fundamentals of solders and soldering
2) SMT组装工艺SMT assembly processes
3) SMT 回流焊接前的问题reflow soldering problems occurred prior to reflow
4) SMT 回流焊接中的问题reflow soldering problems occurred during reflow
5) SMT回流焊接后的问题 reflow soldering problems occurred at post-reflow
6) 汇流曲线优化Reflow profile optimization
7) 国际无铅焊接执行状况Status of global lead-free soldering implementation
8) 最具代表性无铅合金及其特性Prevailing lead-free alloys and their properties
9) 无铅表层处理及其相关特性Lead-free surface finishes and their relative performance
10) 无铅焊接元件和基材Components & substrates for lead-free soldering
11) 无铅回流焊接组装Assembly with lead-free reflow soldering
a) 印刷Printing
b) 回流曲线Profiles
c) 特殊回流曲线Special profiles
d) 微孔设计对空洞的影响Effect of microvia design on voiding
e) 回流气体Reflow Atmosphere
f) 检测Inspection
g) 返修Rework
12) 无铅波峰焊接组装Assembly with lead-free wave soldering
a) 波峰焊料组成Wave solder composition
b) 波峰焊机兼容性Wave machine compatibility
c) 污染的影响Effect of contamination
d) 无铅焊料缺陷Lead-free solder defects
13) 无铅焊点可靠性Reliability of lead-free solder joints
a) 合金的影响Effect of alloy
b) 表层处理的影响Effect of surface finish
c) 微结构Microstructure
14) 可靠性缺陷原理Reliability failure mechanisms
a) Grain boundary sliding and cavitation
b) 铜的影响Effect of Cu
c) Grain and 金属化合物尺寸IMC size
d) Effect of cooling rate on creep
e) Diffusion cavitation of mixed alloys
f) 混合合金空洞Voiding of mixed alloys
g) IMC plate
15) 无铅焊接面临的挑战Challenges of lead-free soldering
a) 黑色焊盘Black pads
b) IMC
c) 焊盘脱离Fillet lift
d) 灯芯状焊料Solder wicking
e) 润湿不良Poor wetting
f) Trace fracture
g) 锡须Tin whisker
h) 表面粗糙Rough appearance
i) 热损伤Thermal damage
j) 助焊剂残留清洗Flux residue cleaning
k) Conductive anodic filament
l) Toxicity
